> Wire-bonder KS4523

Role of the equipment

   The KS4523 is a tool to bond thin metallic wires or ribbons on various surfaces and componants.

Technical specifications

• Manual or semi-automatic operation
• operating area: 134 mm x 134 mm
• Ultrasound bonding 1.3 W or 2.5 W
• Wire diameters:
- Gold: from 13 µm to 76 µm
- Aluminum: from 20 µm to 76 µm
• Fiber optic lighting with target

Accessories

• Substrate holder can be heated up to 250ºC

Examples of available processes and services

• TO-5 packaging of photodetector
• Ceramic packaging of transistors

Academic | Private sector Rate :
42 $/h | 125 $/h