The KS4523 is a tool to bond thin metallic wires or ribbons on various surfaces and componants.
• Manual or semi-automatic operation
• operating area: 134 mm x 134 mm
• Ultrasound bonding 1.3 W or 2.5 W
• Wire diameters:
– Gold: from 13 µm to 76 µm
– Aluminum: from 20 µm to 76 µm
• Fiber optic lighting with target
• Substrate holder can be heated up to 250ºC
• TO-5 packaging of photodetector
• Ceramic packaging of transistors
