> Chemical Polishing Machine CP3000

Role of the equipment

   The Logitech CP3000 allow the thinning or chemical polishing of various substrates.

Technical specifications

• Rotation: 0 to 70 rpm
• Substrates: from small pieces up to 100 mm wafers
• Integrated timer

Accessories

• Automatic slurry distribution.

Examples of available processes and services

• Polishing of laser mirror
• Damascene metal CMP

Academic | Private sector Rate :
42 $/h | 125 $/h