> Polishing Machine Ultra Tec MultiPol

Role of the equipment

   The Multipol polishing machine allow the thinning or chemical polishing of various substrates.

Technical specifications

• Rotation: 0 to 90 rpm
• Automatic slurry distribution.
• Substrates: from small pieces up to 100 mm wafers

Accessories

• Micrometric gauge

Examples of available processes and services

• Wafer thinning
• Delamination for reverse engineering

Academic | Private sector Rate :
42 $/h | 125 $/h