The Heidelberg DWL 66FS is a laser lithography tool able to define and position patterns on a wafer with resolutions close to a micrometer.
• Resolution: 0.8 µm for isolated lines, 1 µm for dense lines
• Alignement precision: from 200 nm to 2000 nm depending on the resolution
• Diode Laser, wavelength: 405 nm
• Writing speed: from 1 mm²/min to 290 mm²/min depending on the resolution
• Standards CAD formats like GDSII, DXF, GERBER, CIF, etc… are accepted
• 3D grayscale lithography (32 tones)
• Writing of chrome photomasks
• Direct writing of photonic structures
