Home » Fiche technique » Polishing Machine Ultra Tec MultiPol
The Multipol polishing machine allow the thinning or chemical polishing of various substrates.
• Rotation: 0 to 90 rpm • Automatic slurry distribution. • Substrates: from small pieces up to 100 mm wafers
• Micrometric gauge
• Wafer thinning • Delamination for reverse engineering
lmn@emt.inrs.ca