Polishing Machine Ultra Tec MultiPol

Manufacturer :

Ultra Tec

Academic :

42 $/h

Private sector Rate :

125 $/h

The Multipol polishing machine allow the thinning or chemical polishing of various substrates.

• Rotation: 0 to 90 rpm
• Automatic slurry distribution.
• Substrates: from small pieces up to 100 mm wafers

• Micrometric gauge

• Wafer thinning
• Delamination for reverse engineering