Role of the equipment
The K.J. Lesker sputtering system CMS-18 allows co-déposition of multi-layers on various substrates.
Technical specifications
• Source 1 and 2: 75 mm target with AC source
• Source 3: 75 mm target with DC source
• Sample holder:
- from pieces up to 150 mm wafers
- Rotation up to 20 rpm
- RF or DC Polarization
• Rapid loading (loadlock)
• Gas ring for reactive sputtering
• PC controlled and programmable receipes
Accessories
• Sample holder heating up to 850ºC
• Source 4: cathode with strong magnets for magnetic materials
• Electric arcs elimination device for pulsed DC sputtering
• In-situ thickness measurement
• Various targets available: Au, Pt, Cr, Cu, ITO,Al, etc
Examples of available processes and services
• Thin film deposition for dielectric mirrors
• Microwave circuit fabrication
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Academic | Private sector Rate :
67 $/h | 145 $/h
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